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dc.contributor.authorDepiver, Joshua Adeniyi
dc.contributor.authorMallik, Sabuj
dc.contributor.authorHarmanto, Dani
dc.date.accessioned2020-04-24T10:49:45Z
dc.date.available2020-04-24T10:49:45Z
dc.date.issued2020-04-18
dc.identifier.citationDepiver, J., Mallik, S., and Harmanto, D. (2020). 'Solder joint failures under thermo-mechanical loading conditions – a review'. Advances in Materials and Processing Technologies, pp. 1-27.en_US
dc.identifier.issn2374-068X
dc.identifier.doi10.1080/2374068X.2020.1751514
dc.identifier.urihttp://hdl.handle.net/10545/624716
dc.description.abstractSolder joints play a critical role in electronic devices by providing electrical, mechanical and thermal interconnections. These miniature joints are also the weakest links in an electronic device. Under severe thermal and mechanical loadings, solder joints could fail in ‘tensile fracture’ due to stress overloading, ‘fatigue failure’ because of the application of cyclical stress and ‘creep failure’ due to a permanent long-term load. This paper reviews the literature on solder joint failures under thermo-mechanical loading conditions, with a particular emphasis on fatigue and creep failures. Literature reviews mainly focused on commonly used lead-free Sn-Ag-Cu (SAC) solders. Based on the literature in experimental and simulation studies on solder joints, it was found that fatigue failures are widely induced by accelerated thermal cycling (ATC). During ATC, the mismatch in coefficients of thermal expansion (CTE) between different elements of electronics assembly contributes significantly to induce thermal stresses on solder joints. The fatigue life of solder joints is predicted based on phenomenological fatigue models that utilise materials properties as inputs. A comparative study of 14 different fatigue life prediction models is presented with their relative advantages, scope and limitations. Creep failures in solder joints, on the other hand, are commonly induced through isothermal ageing. A critical review of various creep models is presented. Many of these strain rate-based creep models are routed to a very well-known Anand Model of inelastic strain rate. Finally, the paper outlined the combined effect of creep and fatigue on solder joint failure.en_US
dc.description.sponsorshipN/Aen_US
dc.language.isoenen_US
dc.publisherTaylor & Francisen_US
dc.relation.urlhttps://www.tandfonline.com/toc/tmpt20/current?nav=tocListen_US
dc.relation.urlhttps://www.tandfonline.com/doi/full/10.1080/2374068X.2020.1751514?casa_token=KNLkvHIGL_kAAAAA%3AnLJE1eq_zh1WvSbQz0xtmOH5Po5eAtPwNZNMEArzuEZHlHHi1FxgCJ5RDGHZ7KVVrsn5lnGgua5pen_US
dc.rightsCC0 1.0 Universal*
dc.rights.urihttp://creativecommons.org/publicdomain/zero/1.0/*
dc.subjectSolder jointen_US
dc.subjectCreep failureen_US
dc.subjectFatigue failureen_US
dc.subjectThermal cyclingen_US
dc.subjectThermal ageingen_US
dc.titleSolder joint failures under thermo-mechanical loading conditions – a reviewen_US
dc.typeArticleen_US
dc.identifier.eissn2374-0698
dc.contributor.departmentUniversity of Derbyen_US
dc.identifier.journalAdvances in Materials and Processing Technologiesen_US
dcterms.dateAccepted2020-04-01
dc.author.detailSTF3893en_US


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