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dc.contributor.authorDepiver, Joshua Adeniyi
dc.contributor.authorMallik, Sabuj
dc.contributor.authorAmalu, Emeka H
dc.contributor.authorHarmanto, Dani
dc.date.accessioned2020-01-14T16:45:27Z
dc.date.available2020-01-14T16:45:27Z
dc.date.issued2019-12
dc.identifier.citationDepiver, J., Mallik, S., Amalu, E. and Harmanto, D. (2019) 'Creep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageing', 2019 21st Electronics Packaging Technology Conference. Singapore, December. IEEE, pp. 1-11.en_US
dc.identifier.isbn9781538630426
dc.identifier.urihttp://hdl.handle.net/10545/624386
dc.description.abstractSolder joints of electronic components are the most critical part of any electronic device. Their untimely failure during the system’s operation often culminates in catastrophic failure of the device. The determination of creep damage in electronic component solder joint is vital to the prediction of crack initiation and prevention of premature failure. This paper presents the creep damage in solder joints in a ball grid array (BGA) soldered on a printed circuit board (PCB) and subjected to thermal cycling as well as isothermal ageing. ANSYS 19.0 package is employed to model the isothermal gaining at -40, 25, 75 and 150℃ temperatures for 45 days. Standard temperature cycle profile is used to simulate the effect of the coefficient of thermal expansion mismatch on the bonded materials in the BGA component. The solders studied are lead-based eutectic solder alloy and lead-free SAC396, SAC387, and SAC305. Based on the results obtained for the stress, strain and strain energy of the solders, the research investigation advises on the most effective solder for achieving improvement in the thermo-mechanical reliability of solder joints in BGA soldered on PCB.en_US
dc.description.sponsorshipUniversity of Derbyen_US
dc.language.isoenen_US
dc.publisherIEEE Xploreen_US
dc.relation.urlhttps://www.eptc-ieee.net/en_US
dc.relation.urlhttps://site.ieee.org/singapore-rleped/conferences/eptc/en_US
dc.rightsCC0 1.0 Universal*
dc.rights.urihttp://creativecommons.org/publicdomain/zero/1.0/*
dc.subjectstrainen_US
dc.subjectthermal cyclingen_US
dc.subjectisothermal ageingen_US
dc.subjectstrain energyen_US
dc.subjectball gird arrayen_US
dc.subjectthermo-mechanicalen_US
dc.titleCreep damage of BGA solder interconnects subjected to thermal cycling and isothermal ageingen_US
dc.typeMeetings and Proceedingsen_US
dc.contributor.departmentUniversity of Derbyen_US
dc.identifier.journalIEEEen_US
dcterms.dateAccepted2019-09-01
refterms.dateFOA2020-01-14T16:45:28Z
dc.author.detailSTF3893en_US


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