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    Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.

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    Authors
    Ekpu, Mathias cc
    Bhatti, Raj
    Okereke, Michael I.
    Mallik, Sabuj
    Otiaba, Kenny
    Affiliation
    University of Greenwich
    Issue Date
    2013-09-03
    
    Metadata
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    Abstract
    Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.
    Citation
    Ekpu, M. et al (2014) 'Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics', Microelectronics Reliability, 54 (1):239
    Publisher
    Elsevier
    Journal
    Microelectronics Reliability
    URI
    http://hdl.handle.net/10545/622573
    DOI
    10.1016/j.microrel.2013.08.006
    Additional Links
    http://linkinghub.elsevier.com/retrieve/pii/S002627141300317X
    Type
    Article
    Language
    en
    ISSN
    00262714
    ae974a485f413a2113503eed53cd6c53
    10.1016/j.microrel.2013.08.006
    Scopus Count
    Collections
    Department of Mechanical Engineering & the Built Environment

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