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dc.contributor.authorEkpu, Mathias
dc.contributor.authorBhatti, Raj
dc.contributor.authorOkereke, Michael I.
dc.contributor.authorMallik, Sabuj
dc.contributor.authorOtiaba, Kenny
dc.date.accessioned2018-04-07T11:59:09Z
dc.date.available2018-04-07T11:59:09Z
dc.date.issued2013-11-14
dc.identifier.citationEkpu, M. et al (2014) 'The effect of thermal constriction on heat management in a microelectronic application ', Microelectronics Journal, 45 (2):159 .en
dc.identifier.issn00262692
dc.identifier.doi10.1016/j.mejo.2013.10.011
dc.identifier.urihttp://hdl.handle.net/10545/622572
dc.description.abstractThermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of four major factors (contact pressure, micro-hardness, root-mean-squared (RMS) surface roughness, and mean absolute surface slope) on thermal contact resistance were investigated. Two lead-free solders (SAC305 and SAC405) were used as thermal interface materials in this study to bridge the interface created between a chip and a heat sink. The results from this research showed that an increase in three of the factors reduces thermal contact resistance while the reverse is the case for RMS surface roughness. In addition, the use of SAC305 and SAC405 resulted in a temperature drop across the microelectronic device. These results might aid engineers to produce products with less RMS surface roughness thereby improving thermal efficiency of the microelectronic application.
dc.description.sponsorshipN/Aen
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S0026269213002516en
dc.rightsArchived with thanks to Microelectronics Journalen
dc.subjectThermal constrictionen
dc.subjectMicro-contacten
dc.subjectHeat sinken
dc.titleThe effect of thermal constriction on heat management in a microelectronic application.en
dc.typeArticleen
dc.contributor.departmentUniversity of Greenwichen
dc.identifier.journalMicroelectronics Journalen
html.description.abstractThermal contact constriction between a chip and a heat sink assembly of a microelectronic application is investigated in order to access the thermal performance. The finite element model (FEM) of the electronic device developed using ANSYS software was analysed while the micro-contact and micro-gap thermal resistances were numerically analysed by the use of MATLAB. In addition, the effects of four major factors (contact pressure, micro-hardness, root-mean-squared (RMS) surface roughness, and mean absolute surface slope) on thermal contact resistance were investigated. Two lead-free solders (SAC305 and SAC405) were used as thermal interface materials in this study to bridge the interface created between a chip and a heat sink. The results from this research showed that an increase in three of the factors reduces thermal contact resistance while the reverse is the case for RMS surface roughness. In addition, the use of SAC305 and SAC405 resulted in a temperature drop across the microelectronic device. These results might aid engineers to produce products with less RMS surface roughness thereby improving thermal efficiency of the microelectronic application.


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