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dc.contributor.authorSharma, Ashutosh
dc.contributor.authorMallik, Sabuj
dc.contributor.authorEkere, Nduka N.
dc.contributor.authorJung, Jae-Pil
dc.date.accessioned2018-04-07T11:36:06Z
dc.date.available2018-04-07T11:36:06Z
dc.date.issued2014-12-30
dc.identifier.citationSharma, A. et al (2014) 'Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes', Journal of the Microelectronics and Packaging Society, 21 (4):83-89.en
dc.identifier.issn12269360
dc.identifier.doi10.6117/kmeps.2014.21.4.083
dc.identifier.urihttp://hdl.handle.net/10545/622571
dc.description.abstractSolder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.
dc.description.sponsorshipN/Aen
dc.language.isoenen
dc.publisherThe Korean Microelectronics and Packaging Societyen
dc.relation.urlhttp://koreascience.or.kr/journal/view.jsp?kj=MOKRBW&py=2014&vnc=v21n4&sp=83en
dc.relation.urlhttp://www.koreascience.or.kr/article/ArticleFullRecord.jsp?cn=MOKRBW_2014_v21n4_83&ordernum=12en
dc.rightsArchived with thanks to Journal of the Microelectronics and Packaging Societyen
dc.subjectSolder paste simulationen
dc.subjectFlip chip packagingen
dc.subjectStencil printing process simulationen
dc.subjectViscosityen
dc.titlePrinting morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.en
dc.typeArticleen
dc.contributor.departmentUniversity of Seoulen
dc.contributor.departmentUniversity of Greenwichen
dc.contributor.departmentUniversity of Wolverhamptonen
dc.identifier.journalJournal of the Microelectronics and Packaging Societyen
refterms.dateFOA2019-02-28T17:02:27Z
html.description.abstractSolder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.


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