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    Printing morphology and rheological characteristics of lead-free Sn-3Ag-0.5Cu (SAC) solder pastes.

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    Mallik_2014_Printing_Morpholog ...
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    Authors
    Sharma, Ashutosh
    Mallik, Sabuj
    Ekere, Nduka N.
    Jung, Jae-Pil
    Affiliation
    University of Seoul
    University of Greenwich
    University of Wolverhampton
    Issue Date
    2014-12-30
    
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    Abstract
    Solder paste plays a crucial role as the widely used joining material in surface mount technology (SMT). The understanding of its behaviour and properties is essential to ensure the proper functioning of the electronic assemblies. The composition of the solder paste is known to be directly related to its rheological behaviour. This paper provides a brief overview of the solder paste behaviour of four different solder paste formulations, stencil printing processes, and techniques to characterize solder paste behaviour adequately. The solder pastes are based on the Sn-3.0Ag-0.5Cu alloy, are different in their particle size, metal content and flux system. The solder pastes are characterized in terms of solder particle size and shape as well as the rheological characterizations such as oscillatory sweep tests, viscosity, and creep recovery behaviour of pastes.
    Citation
    Sharma, A. et al (2014) 'Printing Morphology and Rheological Characteristics of Lead-Free Sn-3Ag-0.5Cu (SAC) Solder Pastes', Journal of the Microelectronics and Packaging Society, 21 (4):83-89.
    Publisher
    The Korean Microelectronics and Packaging Society
    Journal
    Journal of the Microelectronics and Packaging Society
    URI
    http://hdl.handle.net/10545/622571
    DOI
    10.6117/kmeps.2014.21.4.083
    Additional Links
    http://koreascience.or.kr/journal/view.jsp?kj=MOKRBW&py=2014&vnc=v21n4&sp=83
    http://www.koreascience.or.kr/article/ArticleFullRecord.jsp?cn=MOKRBW_2014_v21n4_83&ordernum=12
    Type
    Article
    Language
    en
    ISSN
    12269360
    ae974a485f413a2113503eed53cd6c53
    10.6117/kmeps.2014.21.4.083
    Scopus Count
    Collections
    Department of Mechanical Engineering & the Built Environment

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