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dc.contributor.authorThakur, Vishalen
dc.contributor.authorMallik, Sabujen
dc.contributor.authorVuppala, Vamsien
dc.date.accessioned2018-04-07T11:27:37Z
dc.date.available2018-04-07T11:27:37Z
dc.date.issued2015-02
dc.identifier.citationThakur, V. et al (2015) 'CFD simulation of solder paste flow and deformation behaviours during stencil printing process.' International Journal of Recent Advances in Mechanical Engineering, 4(1).en
dc.identifier.issn2205854
dc.identifier.doi10.14810/ijmech.2015.4101
dc.identifier.urihttp://hdl.handle.net/10545/622570
dc.description.abstractIn 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days. Therefore manufacturing of board and assembly of electronic elements is one of the crucial and significant objectives for most of the companies. Better life of PCB’s depends on electronic elements and its assembly with board. Solder paste is used as adhesive material for assembly purpose. It is deposited on board using stencil and electronic elements are mounted on it and heated for strong bond. This study investigates on factors affecting stencil printing process due to variation in squeegee speed and density of solder paste. This study is based on computational fluid dynamics virtual simulation. Prototype is developed for modelling purpose and simulation software is used to simulate the flow behaviour of solder paste during stencil printing process.
dc.description.sponsorshipN/Aen
dc.language.isoenen
dc.publisherWireilla Scientific Publicationsen
dc.relation.urlhttp://wireilla.com/engg/ijmech/current2015.html#feben
dc.relation.urlhttp://wireilla.com/engg/ijmech/papers/4115ijmech01.pdfen
dc.subjectComputational fluid dynamics (CFD)en
dc.subjectSolder paste simulationen
dc.subjectStencil printing process simulationen
dc.subjectSolderingen
dc.titleCFD simulation of solder paste flow and deformation behaviours during stencil printing process.en
dc.typeArticleen
dc.contributor.departmentUniversity of Greenwichen
dc.identifier.journalInternational Journal of Recent Advances in Mechanical Engineeringen
refterms.dateFOA2019-02-28T16:59:09Z
html.description.abstractIn 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days. Therefore manufacturing of board and assembly of electronic elements is one of the crucial and significant objectives for most of the companies. Better life of PCB’s depends on electronic elements and its assembly with board. Solder paste is used as adhesive material for assembly purpose. It is deposited on board using stencil and electronic elements are mounted on it and heated for strong bond. This study investigates on factors affecting stencil printing process due to variation in squeegee speed and density of solder paste. This study is based on computational fluid dynamics virtual simulation. Prototype is developed for modelling purpose and simulation software is used to simulate the flow behaviour of solder paste during stencil printing process.


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