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    CFD simulation of solder paste flow and deformation behaviours during stencil printing process.

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    Mallik_2015_CFD_Simulation_of_ ...
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    Authors
    Thakur, Vishal
    Mallik, Sabuj
    Vuppala, Vamsi
    Affiliation
    University of Greenwich
    Issue Date
    2015-02
    
    Metadata
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    Abstract
    In 20th century, Electronics elements have become most significant part of the regular life. The main heart of electronic element is PCB which supports and manages mostly machines and equipments these days. Therefore manufacturing of board and assembly of electronic elements is one of the crucial and significant objectives for most of the companies. Better life of PCB’s depends on electronic elements and its assembly with board. Solder paste is used as adhesive material for assembly purpose. It is deposited on board using stencil and electronic elements are mounted on it and heated for strong bond. This study investigates on factors affecting stencil printing process due to variation in squeegee speed and density of solder paste. This study is based on computational fluid dynamics virtual simulation. Prototype is developed for modelling purpose and simulation software is used to simulate the flow behaviour of solder paste during stencil printing process.
    Citation
    Thakur, V. et al (2015) 'CFD simulation of solder paste flow and deformation behaviours during stencil printing process.' International Journal of Recent Advances in Mechanical Engineering, 4(1).
    Publisher
    Wireilla Scientific Publications
    Journal
    International Journal of Recent Advances in Mechanical Engineering
    URI
    http://hdl.handle.net/10545/622570
    DOI
    10.14810/ijmech.2015.4101
    Additional Links
    http://wireilla.com/engg/ijmech/current2015.html#feb
    http://wireilla.com/engg/ijmech/papers/4115ijmech01.pdf
    Type
    Article
    Language
    en
    ISSN
    2205854
    ae974a485f413a2113503eed53cd6c53
    10.14810/ijmech.2015.4101
    Scopus Count
    Collections
    Department of Mechanical Engineering & the Built Environment

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