Show simple item record

dc.contributor.authorNath, Jyotishman
dc.contributor.authorMallik, Sabuj
dc.contributor.authorBorah, Anil
dc.date.accessioned2018-04-07T11:10:14Z
dc.date.available2018-04-07T11:10:14Z
dc.date.issued2015-01-24
dc.identifier.citationNath, J., Mallik, S. & Borah, A. J. (2015) 'A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.', Journal of The Institution of Engineers (India): Series D, 96: 1.en
dc.identifier.issn22502122
dc.identifier.doi10.1007/s40033-014-0063-3
dc.identifier.urihttp://hdl.handle.net/10545/622568
dc.description.abstractThe effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. The specimens used are solder paste (Sn3.8Ag0.7Cu), bench marker II printed circuit boards (PCB), resistors 1206 and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Reflow process was carried out at a peak temperature of 250 °C and the test samples were exposed to isothermal ageing at a constant temperature of 150 °C for a period of 600 h. Shear test was conducted on the PCB’s. The shear strength of the solder joints rapidly increased during isothermal ageing to a certain time period and then started decreasing. Field emission scanning electron microscopy (FESEM) micrograph of the solder joint and energy dispersive X-ray (EDX) was performed on the solder sample to verify the formation of intermetallic compounds.
dc.description.sponsorshipN/Aen
dc.language.isoenen
dc.publisherSpringer Indiaen
dc.relation.urlhttps://link.springer.com/article/10.1007/s40033-014-0063-3en
dc.subjectSMT solder jointsen
dc.subjectShear strengthen
dc.subjectIsothermal ageingen
dc.subjectIntermetallic compounds (IC)en
dc.titleA study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.en
dc.typeArticleen
dc.contributor.departmentUniversity of Greenwichen
dc.contributor.departmentAssam Engineering Collegeen
dc.identifier.journalJournal of The Institution of Engineers (India): Series Den
html.description.abstractThe effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. The specimens used are solder paste (Sn3.8Ag0.7Cu), bench marker II printed circuit boards (PCB), resistors 1206 and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Reflow process was carried out at a peak temperature of 250 °C and the test samples were exposed to isothermal ageing at a constant temperature of 150 °C for a period of 600 h. Shear test was conducted on the PCB’s. The shear strength of the solder joints rapidly increased during isothermal ageing to a certain time period and then started decreasing. Field emission scanning electron microscopy (FESEM) micrograph of the solder joint and energy dispersive X-ray (EDX) was performed on the solder sample to verify the formation of intermetallic compounds.


This item appears in the following Collection(s)

Show simple item record