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    A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.

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    Authors
    Nath, Jyotishman
    Mallik, Sabuj
    Borah, Anil
    Affiliation
    University of Greenwich
    Assam Engineering College
    Issue Date
    2015-01-24
    
    Metadata
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    Abstract
    The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper. The specimens used are solder paste (Sn3.8Ag0.7Cu), bench marker II printed circuit boards (PCB), resistors 1206 and the fabrication of solder joints makes use of conventional surface mount technology (SMT). Reflow process was carried out at a peak temperature of 250 °C and the test samples were exposed to isothermal ageing at a constant temperature of 150 °C for a period of 600 h. Shear test was conducted on the PCB’s. The shear strength of the solder joints rapidly increased during isothermal ageing to a certain time period and then started decreasing. Field emission scanning electron microscopy (FESEM) micrograph of the solder joint and energy dispersive X-ray (EDX) was performed on the solder sample to verify the formation of intermetallic compounds.
    Citation
    Nath, J., Mallik, S. & Borah, A. J. (2015) 'A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints.', Journal of The Institution of Engineers (India): Series D, 96: 1.
    Publisher
    Springer India
    Journal
    Journal of The Institution of Engineers (India): Series D
    URI
    http://hdl.handle.net/10545/622568
    DOI
    10.1007/s40033-014-0063-3
    Additional Links
    https://link.springer.com/article/10.1007/s40033-014-0063-3
    Type
    Article
    Language
    en
    ISSN
    22502122
    ae974a485f413a2113503eed53cd6c53
    10.1007/s40033-014-0063-3
    Scopus Count
    Collections
    Department of Mechanical Engineering & the Built Environment

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