Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.

Hdl Handle:
http://hdl.handle.net/10545/622573
Title:
Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.
Authors:
Ekpu, Mathias ( 0000-0003-1799-7559 ) ; Bhatti, Raj; Okereke, Michael I.; Mallik, Sabuj; Otiaba, Kenny
Abstract:
Microelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.
Affiliation:
University of Greenwich
Citation:
Ekpu, M. et al (2014) 'Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics', Microelectronics Reliability, 54 (1):239
Publisher:
Elsevier
Journal:
Microelectronics Reliability
Issue Date:
3-Sep-2013
URI:
http://hdl.handle.net/10545/622573
DOI:
10.1016/j.microrel.2013.08.006
Additional Links:
http://linkinghub.elsevier.com/retrieve/pii/S002627141300317X
Type:
Article
Language:
en
ISSN:
00262714
Sponsors:
N/A
Appears in Collections:
Department of Mechanical Engineering & the Built Environment

Full metadata record

DC FieldValue Language
dc.contributor.authorEkpu, Mathiasen
dc.contributor.authorBhatti, Rajen
dc.contributor.authorOkereke, Michael I.en
dc.contributor.authorMallik, Sabujen
dc.contributor.authorOtiaba, Kennyen
dc.date.accessioned2018-04-07T12:03:07Z-
dc.date.available2018-04-07T12:03:07Z-
dc.date.issued2013-09-03-
dc.identifier.citationEkpu, M. et al (2014) 'Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics', Microelectronics Reliability, 54 (1):239en
dc.identifier.issn00262714-
dc.identifier.doi10.1016/j.microrel.2013.08.006-
dc.identifier.urihttp://hdl.handle.net/10545/622573-
dc.description.abstractMicroelectronics failure during operation is commonly attributed to ineffective heat management within the system. Hence, reliability of such devices becomes a challenge area. The use of lead-free solders as thermal interface materials to improve the heat conduction between a chip level device and a heat sink is becoming popular due to their promising thermal and mechanical material properties. Finite element modelling was employed in the analysis of the fatigue life of three lead-free solders (SAC105, SAC305, and SAC405) under commercial thermal cycling load (between −40 °C and 85 °C). This paper presents the results of the simulation work focusing on the effect of varying the solder thermal interface thickness (or bond line thickness) on the reliability of the microelectronic device. The results obtained were based on stress, strain, deformation, and plastic work density. The results showed that the fatigue life of the three solders increases as the solder thermal interface thickness increases. Also, the stresses, strains, and deformation were highest around the edges and vertices of the solder interface. In addition, the optimal solder material of choice based on the criteria of this research is given as SAC405. It has higher operational life span and good reliability capabilities.en
dc.description.sponsorshipN/Aen
dc.language.isoenen
dc.publisherElsevieren
dc.relation.urlhttp://linkinghub.elsevier.com/retrieve/pii/S002627141300317Xen
dc.rightsArchived with thanks to Microelectronics Reliabilityen
dc.subjectMicroelectronicsen
dc.subjectSolderingen
dc.titleFatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics.en
dc.typeArticleen
dc.contributor.departmentUniversity of Greenwichen
dc.identifier.journalMicroelectronics Reliabilityen
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